Did you mean: SC10 PACKING
Product Datasheet Search Results:
4 Pages, 314 KB, Original- AMD PACKAGES AND PACKING
- Advanced Micro Devices
- Board Assembly
10 Pages, 1485 KB, Original- PACKAGES AND PACKING
- Advanced Micro Devices
- Die and Wafer Shipments
19 Pages, 236 KB, Original- PACKING CONSIDERATIONS METHODS MATERIALS AND REC
- National Semiconductor
- Packing Considerations(Methods, Materials and Recycling)
16 Pages, 127 KB, Original- SC01 PACKING 1996 1
- Philips Semiconductors / Nxp Semiconductors
- PACKING AND PACKING QUANTITIES
2 Pages, 7 KB, Original- SC10 PACKING
- Philips Semiconductors / Nxp Semiconductors
- Small-signal Transistors and Diodes Packing Quantities
6 Pages, 79 KB, Original- SC11 PACKING
- Philips Semiconductors / Nxp Semiconductors
- Package Overview
11 Pages, 75 KB, Original- SC13 PACKING
- Philips Semiconductors / Nxp Semiconductors
- PACKING AND PACKING QUANTITIES
12 Pages, 79 KB, Original- SC13 PACKING 98 1
- Philips Semiconductors / Nxp Semiconductors
- Packing and packing quantities PowerMOS transistors
Product Details Search Results:
Golledge.com/HCD210/AMDPAFREQ
{"Phase Noise":"-145 dBc/Hz","Physical Dimension":"L70.0XB50.0XH40.0 (mm)/L2.756XB1.969XH1.575 (inch)","Terminal Finish":"NOT SPECIFIED","Aging":"0.01 PPM/DAY","Mounting Feature":"CHASSIS MOUNT","Input Power":"1 W","Oven Supply Voltage":"15V","Status":"ACTIVE","Lead Free":"Yes","Operating Temperature-Min":"-20 Cel","Supply Voltage-Max":"15.5 V","EU RoHS Compliant":"Yes","Supply Voltage-Min":"14.5 V","Supply Voltage-Nom":"15 V","Operating Temperature-Max":"60 Cel","Operating Frequency-Max":"100 MHz","Oscilla...
1509 Bytes - 15:22:29, 31 October 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
| File Name | File Size (MB) | Document | MOQ | Support |
|---|---|---|---|---|
| EASY_PDU_NETWORK_MANAGEMENT_CARD_3_KIT_EP9640NMC3_UNPACKING_TME35657.pdf | 0.08 | 1 | Request | |
| NETSHELTER_UPS_DEPTH_WALL_MOUNT_ENCLOSURES_GUIDE_FOR_RECEIVING_AND_UNPACKING_990_900014_BW.pdf | 2.07 | 1 | Request | |
| ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC15UR500ACI_UNPACKING_SHEET_TME14047.pdf | 0.71 | 1 | Request | |
| ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC42UR2KACI_IN_MDC24UR1KACI_IN_MDC24UR500ACI_IN_UNPACKING_TME18017B.pdf | 0.73 | 1 | Request | |
| TME18018B_ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC15UR500ACI_IN_UNPACKING_SHEET.pdf | 0.58 | 1 | Request | |
| ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC42UR2KACI_MDC24UR1KACI_MDC24UR500ACI_UNPACKING_SHEET_TME13305.pdf | 0.77 | 1 | Request | |
| NETSHELTER_SX_CABINET_2ND_GENERATION_UNPACKING_SHEET_TME19836_ML.pdf | 2.39 | 1 | Request |
