................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
Copyright (c) 2001-2012, Texas Instruments Incorporated SN74LVC2G07 SCES308J - AUGUST 2001 - REVISED AUGUST 2012 www.ti.com ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV QFN - DRY Reel of 3000 SN74LVC2G07DBVR C07_ (4) Reel of 5000 SN74LVC2G07DRYR CV (4) Reel of 5000 SN74LVC2G07DSFR CV Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (2) (3) (4) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) QFN - DSF (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
Copyright (c) 2001-2012, Texas Instruments Incorporated SN74LVC2G07 SCES308J - AUGUST 2001 - REVISED AUGUST 2012 www.ti.com ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV QFN - DRY Reel of 3000 SN74LVC2G07DBVR C07_ (4) Reel of 5000 SN74LVC2G07DRYR CV (4) Reel of 5000 SN74LVC2G07DSFR CV Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (2) (3) (4) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) QFN - DSF (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
older Links: SN74LVC2G07 11 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74LVC2G07DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C075, C07F, C07K, C07R) SN74LVC2G07DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C07F, C07R) SN74LVC2G07DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CV5, CVF, CVK, CV R) SN74LVC2G07DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
(Pb-free) SN74LVC2G07YZAR NanoStar - WCSP (DSBGA) 0.23-mm Large Bump - YEP Reel of 3000 SOT (SC-70) - DCK _ _ _CV_ SN74LVC2G07YEPR NanoFree - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) SOT (SOT-23) - DBV TOP-SIDE MARKING SN74LVC2G07YZPR Reel of 3000 SN74LVC2G07DBVR Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT C07_ CV_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER
ackflow through the device when it is powered down. ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instrum
................................ www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C (2) (3) TOP-SIDE MARKING (3) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_ SOT (SOT-23) - DBV Reel of 3000 SN74LVC2G07DBVR C07_ Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT SOT (SC-70) - DCK (1) ORDERABLE PART NUMBER CV_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER