-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
NG (2) NanoStarTM - WCSP (DSBGA) 0.23-mm Large Bump - YEP Tape and reel TS5A3157YEPR NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ _ _ _JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free). FUNCTION TABLE IN NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX V+ Supply voltage range (3) -0.5 6
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
-40C to 85C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) (3) MIN MAX UNIT -0.5 6.5 V -0.5 V+ + 0.5 V V+ Supply
CKAGE (1) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Tape and reel TS5A3157YZPR _ _ _JC_ SOT (SOT-23) - DBV Tape and reel TS5A3157DBVR JC5_ SOT (SC-70) - DCK Tape and reel TS5A3157DCKR JC_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE NC TO COM, COM TO NC NO TO COM, COM TO NO L ON OFF H OFF ON IN Absolute Minimum and Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX V+ Supply voltage range (3) -0.5 6.5 V VNO VN